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TDA1170D
LOW-NOISE TV VERTICAL DEFLECTION SYSTEM
. . .
COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS
DESCRIPTION The TDA 1170D is a monolithic integrated circuit in a 16-lead dual in-line plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS
DIP16 (Plastic Package) ORDER CODE : TDA1170D
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND GROUND POWER AMPLIFIER OUTPUT POWER AMPLIFIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
RAMP GENERATOR COMPENSATION AMPLIFIER INPUT GROUND GROUND OSCILLATOR SYNC. INPUT HEIGHT ADJUST
1170D-01.EPS
December 1992
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TDA1170D
BLOCK DIAGRAM
+ VS
FREQ
8
2
3
7
TDA1170D
11 OSCILLATOR VOLTAGE REGULATOR FLYBACK GENERATOR POWER AMPLIFLIER 6
YOKE SYNC 10 SYNC CIRCUIT RAMP GENERATOR BUFFER STAGE PREAMPLIFLIER 15
4
5
12
13
9
1 16 LINEARITY
14
HEIGHT
1170D-02.EPS
ABSOLUTE MAXIMUM RATINGS
Symbol VS V6, V7 V14 Io Io Io I3 I3 I10 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2msec Output Peak Current at f = 50Hz t 10sec Output Prak Current at f = 50Hz t > 10sec Pin 3 DC Current at V6 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5msec Pin 10 Current Power Dissipation : at Ttab = 90C at Tamb = 70 C (free air) Storage and Junction Temperature Parameter Value 35 60 + 10 - 0.5 2 2.5 1.5 100 1.8 20 4.3 1 - 40 to 150 Unit V V V V A A A mA A mA W W C
1170D-01.TBL 1170D-02.TBL
THERMAL DATA
Symbol Rth j-case R th j-amb Parameter Thermal Resistance Junction-pins Thermal Resistance Junction-ambient Max Max Value 14 80 Unit C/W C/W*
* Obtained with pins 4, 5, 12, 13 soldered to printed circuit with minimized copper area.
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TDA1170D
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC, unless otherwise specified) DC CHARACTERISTICS
Symbol I2 I7 - I11 - I14 - I16 - I16 I16 I16 VS V1 V3 V6 Parameter Pin 2 Quiescent Current Pin 7 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Quiescent Output Voltage I1 = 1mA I3 = 10mA Vs = 10V R1 = 1k, R2 = 1k Vs = 35V R1 = 3k, R2 = 1k V6L V6H V8 V9 V8 V9 , VS VS V14 R10 Output Saturation Voltage to Ground Output Saturation Voltage to Supply Regulated Voltage at Pin 8 Regulated Voltage at Pin 9 Regulated Voltage Drift with Supply Voltage Amplifier Input Reference Voltage Pin 10 Input Resistance V10 0.4V I9 = 20A VS = 10 to 35V 2.07 1 - I6 = 0.1A - I6 = 0.8A I6 = 0.1A I6 = 0.8A 6.1 6.2 4.1 8.3 Test Conditions I3 = 0 I6 = 0 V11 = 1V V14 = 1V V16 = 0 I9 = 20A, V16 = 0 V16 = 0 to 12V, I9 = 20A 10 1 300 4.4 8.8 0.9 1.9 1.4 2.8 6.5 6.6 1 2.2 2.3 18.5 Min. Typ. 7 8 0.1 1 0.02 20 0.2 Max. 14 17 1 10 0.3 21.5 1 35 1.4 450 4.75 9.45 1.2 2.3 2.1 3.2 6.9 7 Unit mA mA A A A A % V V mV V V V V V V V V mV/V V M Fig. 1b 1b 1a 1b 1a 1b 1b - - 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b - 1a
1170D-03.TBL
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TDA1170D
Figure 1 : DC Test Circuit Figure 1a
V3 I3 + Vs
Figure 1b
I2 + Vs I7 2
3 2 7
7
10
TDA1170D
11 I10 9 1k 16 4 5 12 13 14
6
11
TDA1170D
14
R1
8
V6
16
9
4
5
12
13 - I14
- I11 1V 8V
- I16 R2
V8
- I16
V9
1V
100k
1170D-03.EPS
1V
1170D-04.EPS
Figure 1c
+ Vs
Figure 1d
+ Vs
2
7
I6
2
7
V6H
11
TDA1170D
6
11
TDA1170D
6
14
4
5
12
13
14
4
5
12
13
4V
V6L
1V
1170D-05.EPS
I6
1170D-06.EPS
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TDA1170D
ELECTRICAL CHARACTERISTICS (refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25oC, unless otherwise specified) AC CHARACTERISTICS
Symbol Is I10 V6 tfly VON fo f f VS f Tpins Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Synchronization Range Frequency Drift with Supply Voltage Frequency Drift vs. Pins 4, 5, 12 and 13 Temp. Iy = 1App Iy = App Pin 11 Connected to GND (P1 = R1) = 260k, C2 = 0.1F (P1 = R1) = 300k, C2 = 0.1F I8 = 0.5mA Vs = 10 to 35V Tpins = 40 to 120C 14 0.005 0.01 48.5 42.2 Parameter Test Conditions Iy = 1App 500 45 0.7 40 Min. Typ. 140 Max. Unit mA A V ms mVPP Hz Hz Hz
1170D-04.TBL 1170D-07.EPS
Hz/V Hz/C
Figure 2 : AC Test Circuit
VS = 22V 470F 1N4001
0.1F
100F 3
7
4
5
12 13
2
3.3 6
0.1mF
VD 220k 100pF 5.6k 470pF 5.6k YOKE Ry = 10 Ly = 20mH
Sync. Input
10
T D A 1 1 7 0 D
15
14 22k 1 100k 10F 1000F
11
P1 R1
8
9
16 47k 1.8k
220k
0.1F VRf 0.1F Rf 1W
C2
0.1F
120k
910k
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TDA1170D
Figure 3 : Typical Application Circuit for Smal Screen B/W TV SET (Ry = 2.9, Ly = 6mH, Iy = 1.1App)
VS = 12V D1 1N4001 C5 470F
C1 0.1F
C4 100F 3
7
4
5
12 13
2
R8 3.3 6
C10 0.1F
C2 f sync = 50Hz
0.1F 10
R1 4.7k
T D A 1 1 7 0 D
R5 150k 15 C6 470pF 14 R6 22k 1 P3 100k
C9 100pF R11 1.8k R13 270 R10 2.2k C11 100F
YOKE Ry = 2.9 Ly = 6mH
C12 2200F
11
P1
100k R2 150k
8
9
16
P2 220k R3 220k R4 910k
C7 0.1F C8 0.1F
R7 82k
R9 1.8k
C3
0.1F
Figure 4 : P.C. Board and Components Layout of the Circuit of Fig. 3 (1 : 1 scale)
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1170D-09.TIF
1170D-08.EPS
R12 1
TDA1170D
MOUNTING INSTRUCTION The Rth j-amb of the TDA 1170D can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). The diagram of figure 7 shows the maximum dissipable power P tot and the Rth j-amb as a function of Figure 5 : Example of P.C. Board Copper Area which is Used as Heatsink the side "l" of two equal square copper areas having a thickness of 35 (1.4 mils). During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 6 : External Heatsink Mounting Example
1170D-10.EPS
Figure 7 :
Maximum Dissipable Power and Junction-Ambient Thermal Resistance versus Side "l"
Figure 8 :
Maximum Allowable Power Dissipation versus Ambient Temperature
1170D-12.EPS
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1170D-13.EPS
1170D-11.EPS
TDA1170D
PACKAGE MECHANICAL DATA 16 PINS - PLASTIC PACKAGE
a1
I
b Z
B e3
e
L
b1
E
D
16
9
F
1
8
Dimensions a1 B b b1 D E e e3 F i L Z
Min. 0.51 0.77
Millimeters Typ.
Max. 1.65
Min. 0.020 0.030
Inches Typ.
Max. 0.065
0.5 0.25 20 8.5 2.54 17.78 7.1 5.1 3.3 1.27
0.020 0.010 0.787 0.335 0.100 0.700 0.280 0.201 0.130 0.050
DIP16.TBL
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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PM-DIP16.EPS

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